TSMC Expands Advanced Packaging Capacity: Two New Plants in Chiayi, Arizona Plans Move Forward
According to three sources, TSMC is expanding its advanced chip packaging capacity: Reuters says it will add two advanced packaging plants in Chiayi Science Park in Taiwan; another source says TSMC plans to build an advanced packaging plant in Arizona and has already started construction; a third source says Phase 2 in Chiayi is also seeing three advanced packaging facilities under construction. The sources agree on the core direction of advanced packaging expansion, but differ on plant counts, locations, and project timelines, and some key details cannot be confirmed from the provided sources.