Tech Logic

The semiconductor equipment market will reach $344 billion by 2032, with AI and high-performance computing serving as core drivers.

According to a MarketsandMarkets report, the global semiconductor manufacturing equipment market is projected to grow from $166.35 billion in 2025 to $344.36 billion by 2032, at a compound annual growth rate (CAGR) of 11%. Demand for advanced-node chips driven by AI and high-performance computing is the primary growth driver, with the Asia-Pacific region holding the dominant share and the Americas region experiencing the fastest growth.

Sep 7, 2026

The Battle for Dominance in Advanced Chip Packaging: A New Front in the AI Chip Race

Advanced chip packaging has become the core battleground in the AI chip race. TSMC leads with its CoWoS technology, while Samsung and Intel are accelerating their efforts to catch up, and governments around the world regard it as key to technological sovereignty. The article reviews technology trends, industry competition, and the regional landscape.

Sep 1, 2026

Global Battle for Advanced Chip Packaging Dominance — The New Frontier in the AI Chip Race

As traditional process nodes approach physical limits, advanced chip packaging (such as 2.5D/3D packaging, chiplets, hybrid bonding, etc.) has become key to improving performance and reducing power consumption. The explosive demand for AI accelerators has made advanced packaging capacity a globally scarce resource. TSMC leads with its CoWoS technology, while Samsung and Intel are racing to catch up. Governments are incorporating advanced packaging into their technology sovereignty strategies, intensifying competition in the global supply chain.

Aug 31, 2026

The Global Battle for Advanced Chip Packaging: The New Frontier of the AI Chip Race

Advanced chip packaging is becoming the main battleground in global semiconductor competition. TSMC leads with its CoWoS technology, while Samsung and Intel are actively catching up. AI demand has sparked a global arms race across the supply chain, with governments around the world increasing investments to ensure technological autonomy.

Aug 25, 2026

Global advanced chip packaging race: the new front line of the AI chip competition

Semiconductor manufacturing is shifting from pursuing smaller process nodes to more advanced chip packaging technology. TSMC has taken the lead with CoWoS, while Samsung and Intel are accelerating their pursuit. Countries around the world also regard advanced packaging as key to technological sovereignty, and a new race centered on AI chip packaging is now in full swing.

Aug 24, 2026

Chip Industry Weekly Report: Data Center Transformation, Capacity Expansion, and Capital Waves

This week's chip industry news roundup: UC Berkeley questions the necessity of large-scale data centers; OCP launches CPO system architecture initiative; ASE and Lam Research expand production capacity; Sony and TSMC collaborate on image sensors; Nvidia's $500 billion AI infrastructure financing plan sparks heated debate; enterprise SSD share in the storage market rises; Intel secures $20 billion in financing, etc.

Aug 18, 2026