Stories
Tracks the technical systems, bottlenecks, and standards that reshape industrial power before they become mainstream narratives.
The article reviews how large language models enhance various aspects of scientific research, points out their limitations in the basic sciences, and proposes aligning with human scientific goals and establishing clear evaluation metrics to deeply integrate LLMs.
As the annual magazine of NMAMIT, Nidarshan-26 revolves around the theme "From Classics to Systems," bringing together leadership messages, campus updates, and reflections from faculty and students, embodying the continuity and innovation of knowledge from ancient times to the present.
In 2026, enterprises will focus on closing the AI readiness gap, AI agents will accelerate in adoption and trigger governance changes, data infrastructure will evolve to become agent-ready, and companies will truly measure the return on investment of AI.
Advanced chip packaging is becoming the main battleground in global semiconductor competition. TSMC leads with its CoWoS technology, while Samsung and Intel are actively catching up. AI demand has sparked a global arms race across the supply chain, with governments around the world increasing investments to ensure technological autonomy.
Semiconductor manufacturing is shifting from pursuing smaller process nodes to more advanced chip packaging technology. TSMC has taken the lead with CoWoS, while Samsung and Intel are accelerating their pursuit. Countries around the world also regard advanced packaging as key to technological sovereignty, and a new race centered on AI chip packaging is now in full swing.
This article reviews the discourse by DeepMind CEO Demis Hassabis on the critical role of world models in achieving AGI, and analyzes the current research status in this field, including Google Genie, Tesla FSD, Nvidia's simulation platforms, as well as the work of Yann LeCun and others.