Stories
Tracks the technical systems, bottlenecks, and standards that reshape industrial power before they become mainstream narratives.
As demand for AI and high-performance computing surges, advanced chip packaging has become the new battleground in the semiconductor industry. TSMC leads with CoWoS technology, while Samsung and Intel are actively catching up. Governments also view packaging capability as key to technological sovereignty. This article analyzes the market landscape, key technologies, and geopolitical implications.
According to TrendForce's latest forecast, AI server shipments will grow by more than 20% in 2026, with NVIDIA facing intense competition from AMD and cloud service providers' self-developed chips. As chip power consumption exceeds 1000W, the adoption rate of liquid cooling technology is expected to reach 47%. HBM4 and optical interconnect technologies will break through bandwidth bottlenecks, providing support for trillion-parameter models. These trends will collectively shape the future of the global technology industry.
In 2025, the European semiconductor market is valued at $137.3 billion, and it is expected to reach $220.25 billion by 2034, with a compound annual growth rate of 5.4%. Electric vehicles, industrial automation, and the European Chips Act are the main growth drivers.
Data centers, especially AI-driven ones, are expected to consume 20% of U.S. electricity by 2035. Despite challenges such as grid bottlenecks and natural gas supply constraints, the rapid advancement of nuclear power is key to meeting the demand for reliable, clean electricity.
The United States is vigorously rebuilding semiconductor manufacturing, but the material foundation is key. From PFAS alternatives to rare earth magnets, material innovation determines future competitiveness.
TSMC commits to invest another $100 billion to expand US production capacity, possibly building four new wafer fabs in Arizona.